The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Nov. 09, 2017
Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventors:

Shuji Aiba, Kanagawa, JP;

Shigeru Takakura, Kanagawa, JP;

Yasuhiro Kitamura, Kanagawa, JP;

Kenzo Akiyama, Kanagawa, JP;

Assignee:

SODICKCO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/73 (2006.01); B29C 45/26 (2006.01); B29C 45/78 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7306 (2013.01); B29C 45/2673 (2013.01); B29C 45/78 (2013.01); B29C 2945/76531 (2013.01);
Abstract

The cassette mold type injection molding machine controls a first temperature control circuit to supply a heat medium having a heating temperature from a first heating device to a matrix supply path, controls a second temperature control circuit to supply the heat medium having a cooling temperature from a second heating device to the core cavity supply path, and performs cassette mold cool down control in which a bypass control valve is controlled to connect a bypass path and a main body supply path, such that a second heating device or a core cavity supply path is connected to a main body supply path, and thus the heat medium having the heating temperature is supplied to the matrix and the heat medium having the cooling temperature is supplied to a cassette mold main body and a core cavity portion.


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