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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10946558 B1

PDFFull Text
Expired
Date of Patent:
Mar. 16, 2021

Filed:

May. 19, 2017

Lamination molding apparatus

Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventors:

Ichiro Araie, Kanagawa, JP;

Shuji Okazaki, Kanagawa, JP;

Assignee:

Sodick Co., Ltd., Kanagawa, JP;

Attorney:

Maier & Maier, PLLC

Primary Examiner:

Nahida Sultana

Int. Cl.
CPC ...
B29C 35/08 (2006.01); B22F 3/10 (2006.01); B22F 3/105 (2006.01); B29C 64/153 (2017.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/268 (2017.01); B22F 10/00 (2021.01); C04B 35/64 (2006.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
B29C 35/0805 (2013.01); B22F 3/1017 (2013.01); B22F 10/00 (2021.01); B29C 64/153 (2017.08); B29C 64/268 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); C04B 35/64 (2013.01); B22F 10/10 (2021.01); B22F 2999/00 (2013.01); B29C 2035/0833 (2013.01); B29C 2035/0838 (2013.01); Y02P 10/25 (2015.11);
Abstract

A lamination molding apparatus including a chamber covering a molding region; a laser beam source to emit a laser beam for sintering a material powder supplied on the molding region to form a sintered layer; and a scan unit to scan the laser beam. The laser beam has one or more spot shapes including at least an elongated shape, and the scan unit is configured to scan the laser beam, of which the spot shape is an elongated shape, in a lateral direction of the elongated shape, is provided.

Find Patent Forward Citations

Araie, Ichiro. (2021). Lamination molding apparatus (U.S. Patent No. 10946558). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10946558

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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