The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Dec. 27, 2016
Applicant:

Lg Hausys, Ltd., Seoul, KR;

Inventors:

Kang-Hyun Song, Anyang-si, KR;

Jong-Sung Park, Daejeon, KR;

Hee-June Kim, Seongnam-si, KR;

Hee-Jung Lee, Anyang-si, KR;

Young-E Moon, Anyang-si, KR;

Assignee:

LG HAUSYS, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29B 15/12 (2006.01); C08J 5/24 (2006.01); B29B 15/10 (2006.01); B29C 70/54 (2006.01); B29C 70/34 (2006.01); B29C 33/00 (2006.01); B29K 307/04 (2006.01); B29K 309/08 (2006.01);
U.S. Cl.
CPC ...
B29B 15/122 (2013.01); B29B 15/10 (2013.01); B29C 33/0077 (2013.01); B29C 70/345 (2013.01); B29C 70/54 (2013.01); C08J 5/24 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01);
Abstract

Disclosed are a prepreg manufacturing device and a prepreg manufacturing method using the same. A prepreg manufacturing device according to an embodiment of the present invention comprises: a first resin inflow part which is formed inside an upper mold, receives a resin supplied from an extruder, and discharges the resin to a reinforced fiber flowing to a lower part in the upper mold; and a second resin inflow part which is formed inside a lower mold, receives the resin supplied from the extruder, and discharges the resin to the reinforced fiber flowing to an upper part of the lower mold.


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