The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Oct. 04, 2017
Applicant:

Us Synthetic Corporation, Orem, UT (US);

Inventors:

Mark P. Chapman, Provo, UT (US);

Ronald W. Ward, Pleasant Grove, UT (US);

Nicholas Christensen, Spanish Fork, UT (US);

Damon B. Crockett, Mapleton, UT (US);

Assignee:

US SYNTHETIC CORPORATION, Orem, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/567 (2006.01); E21B 10/46 (2006.01); B24D 18/00 (2006.01); B23K 26/364 (2014.01); B24D 3/04 (2006.01);
U.S. Cl.
CPC ...
B24D 18/00 (2013.01); B23K 26/364 (2015.10); B24D 3/04 (2013.01); E21B 10/46 (2013.01); E21B 10/567 (2013.01); E21B 10/5673 (2013.01); E21B 10/5676 (2013.01);
Abstract

Methods of laser cutting polycrystalline diamond tables and polycrystalline diamond compacts are disclosed. Laser cutting of the polycrystalline diamond table provides an alternative to electrical-discharge machining ('EDM'), grinding with a diamond wheel, or lapping with a diamond wheel. Grinding or lapping with a diamond wheel is relatively slow and expensive, as diamond is used to remove a diamond material. EDM cutting of the polycrystalline diamond table is sometimes impractical or even impossible, particularly when the cobalt or other infiltrant or catalyst concentration within the polycrystalline diamond table is very low (e.g., in the case of a leached polycrystalline diamond table). As such, laser cutting provides a valuable alternative machining method that may be employed in various processes such as laser scribing, laser ablation, and laser lapping.


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