The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2021

Filed:

Aug. 04, 2016
Applicant:

Toshiba Mitsubishi-electric Industrial Systems Corporation, Chuo-ku, JP;

Inventors:

Akihiro Ichinose, Tokyo, JP;

Yoshihito Yamada, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/10 (2006.01); B23K 20/02 (2006.01); B29C 65/08 (2006.01); H01R 43/02 (2006.01);
U.S. Cl.
CPC ...
B23K 20/103 (2013.01); B23K 20/02 (2013.01); B23K 20/10 (2013.01); B23K 20/106 (2013.01); B29C 65/08 (2013.01); H01R 43/0207 (2013.01);
Abstract

A bonding tool as the tool for ultrasonic bonding includes a plurality of protrusion portions in a protrusion region at a contact tip portion. The plurality of protrusion portions are equally spaced at a longitudinal direction interval in an X direction as the longitudinal direction of the protrusion region, and an X direction outermost protrusion portion positioned outermost in the X direction is disposed separately from a side edge of the protrusion region in the X direction by a longitudinal direction side edge distance. The plurality of protrusion portions are disposed so that a first disposition condition {0.349≤EX (the longitudinal direction side edge distance/DX (the longitudinal direction interval)≤0.510} is satisfied.


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