The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Apr. 21, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tetsuya Ueda, Tokyo, JP;

Hironobu Shibata, Tokyo, JP;

Yukinobu Tarui, Tokyo, JP;

Hidenori Ishibashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/387 (2006.01); H01P 1/383 (2006.01); H01P 11/00 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H01P 1/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01P 1/383 (2013.01); H01P 1/30 (2013.01); H01P 1/387 (2013.01); H01P 11/00 (2013.01); H05K 1/115 (2013.01); H05K 1/141 (2013.01); H05K 3/3436 (2013.01); H05K 2201/049 (2013.01); H05K 2201/086 (2013.01); H05K 2201/09581 (2013.01); H05K 2201/10977 (2013.01);
Abstract

In a non-reciprocal circuit element, a permanent magnet is connected to one main surface of a magnetic plate, and a circuit board is connected to the other main surface of the magnetic plate, with a solder bump lying between the circuit board and the other main surface. The permanent magnet can control the transmission of electrical signal from each of a plurality of signal conductors of circuit board to a corresponding one of a plurality of input/output terminals of the magnetic plate. The non-reciprocal circuit element further includes an underfill material arranged between the magnetic plate and the circuit board. The magnetic plate has a through hole formed therein, the through hole extending from one main surface to the other main surface. The through hole has an empty space in which at least a part of a conductive film arranged in the through hole is exposed.


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