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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10944046 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Nov. 25, 2019

Semiconductor device

Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Yuya Hasegawa, Kyoto, JP;

Satohiro Kigoshi, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:

Hamre, Schumann, Mueller & Larson, P.C.

Primary Examiner:

Earl N Taylor

Int. Cl.
CPC ...
H01L 43/04 (2006.01); H01L 23/544 (2006.01); H01L 23/495 (2006.01); G01R 33/07 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 43/06 (2006.01); H01L 43/14 (2006.01);
U.S. Cl.
CPC ...
H01L 43/04 (2013.01); G01R 33/07 (2013.01); H01L 21/4828 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3121 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49582 (2013.01); H01L 23/544 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 43/065 (2013.01); H01L 43/14 (2013.01); H01L 23/3107 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48096 (2013.01); H01L 2224/48097 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48177 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/85005 (2013.01); H01L 2224/97 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18165 (2013.01);
Abstract

A semiconductor device includes a semiconductor element, a conductive layer, terminals, and a sealing resin. The conductive layer, containing metal particles, is in contact with the reverse surface and the side surface of the semiconductor element. The terminals are spaced apart from and electrically connected to the semiconductor element. The sealing resin covers the semiconductor element. The conductive layer has an edge located outside of the semiconductor element as viewed in plan. Each terminal includes a top surface, a bottom surface, an inner side surface held in contact with the sealing resin, and the terminal is formed with a dent portion recessed from the bottom surface and the inner side surface. The conductive layer and the bottom surface of each terminal are exposed from a bottom surface of the sealing resin.

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