The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Mar. 23, 2020
Applicant:

National Chiao Tung University, Hsinchu, TW;

Inventors:

Ray-Hua Horng, Taichung, TW;

Hsiang-An Feng, Hsinchu, TW;

Cheng-Yu Chung, Taoyuan, TW;

Chia-Wei Tu, Toufen, TW;

Fu-Gow Tarntair, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 21/683 (2006.01); H01L 33/40 (2010.01); H01L 33/38 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 21/6836 (2013.01); H01L 33/0062 (2013.01); H01L 33/0075 (2013.01); H01L 33/0093 (2020.05); H01L 33/32 (2013.01); H01L 33/38 (2013.01); H01L 33/40 (2013.01); H01L 2221/68327 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A method for manufacturing micro light-emitting diode chips includes the steps of: providing a to-be-divided light-emitting component, which includes a metal substrate and a plurality of micro light-emitting diode dies disposed on the metal substrate to permit the metal substrate to define a to-be-etched region among the micro light-emitting diode dies; and etching the metal substrate to remove the to-be-etched region so as to divide the light-emitting component into a plurality of the micro light-emitting diode chips.


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