The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Nov. 09, 2018
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Ryota Mishima, Osaka, JP;

Masashi Hino, Osaka, JP;

Tomomi Meguro, Osaka, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0224 (2006.01); H01L 31/0236 (2006.01); H01L 51/44 (2006.01); H01L 31/028 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022425 (2013.01); H01L 31/028 (2013.01); H01L 31/0224 (2013.01); H01L 31/0236 (2013.01); H01L 31/02363 (2013.01); H01L 31/022483 (2013.01); H01L 31/1804 (2013.01); H01L 31/1888 (2013.01); H01L 51/44 (2013.01); Y02E 10/549 (2013.01); Y02P 70/50 (2015.11);
Abstract

A method for manufacturing a stacked photoelectric conversion device includes forming an intermediate transparent conductive layer on a light-receiving surface of a crystalline silicon-based photoelectric conversion unit including a crystalline silicon substrate, and forming a thin-film photoelectric conversion unit on the intermediate transparent conductive layer. The stacked photoelectric conversion device includes the crystalline silicon-based photoelectric conversion unit, the intermediate transparent conductive layer, and the thin-film photoelectric conversion unit. The light-receiving surface of the crystalline silicon-based photoelectric conversion unit has a textured surface including a plurality of projections and recesses. The textured surface has an average height of 0.5 μm or more. The intermediate transparent conductive layer fills the recesses of the textured surface and covers the tops of the projections of the textured surface. At least a part of the thin-film photoelectric conversion unit is deposited by a wet method.


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