The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

May. 30, 2017
Applicant:

Hamamatsu Photonics K.k., Hamamatsu, JP;

Inventors:

Ryutaro Tsuchiya, Hamamatsu, JP;

Terumasa Nagano, Hamamatsu, JP;

Yuta Tsuji, Hamamatsu, JP;

Go Kawai, Hamamatsu, JP;

Yuki Okuwa, Hamamatsu, JP;

Assignee:

HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0216 (2014.01); G01J 1/42 (2006.01); G01J 1/02 (2006.01); H01L 27/146 (2006.01); G01J 1/04 (2006.01); G01J 1/44 (2006.01); H01L 23/00 (2006.01); H01L 25/04 (2014.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H01L 31/107 (2006.01); H01L 25/16 (2006.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 31/02164 (2013.01); G01J 1/02 (2013.01); G01J 1/0437 (2013.01); G01J 1/42 (2013.01); G01J 1/44 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/042 (2013.01); H01L 27/146 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02019 (2013.01); H01L 31/107 (2013.01); G01J 2001/4466 (2013.01); H01L 25/167 (2013.01); H01L 31/02322 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/12043 (2013.01);
Abstract

An optical detection unit includes a first wiring substrate that has a first main surface, a plurality of optical detection chips that each have a light receiving surface and a rear surface on a side opposite to the light receiving surface and are two-dimensionally arranged on the first main surface, a first bump electrode that electrically connects the optical detection chip to the first wiring substrate, a light transmitting portion that is provided on the light receiving surface, and a light shielding portion that has light reflection properties or light absorption properties. The optical detection chip includes a Geiger-mode APD and is mounted on the first wiring substrate by the first bump electrode in a state in which the rear surface faces the first main surface.


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