The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

May. 03, 2019
Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Frederic Stephane Diana, Santa Clara, CA (US);

Yifeng Qiu, San Jose, CA (US);

Michael Wasilko, San Jose, CA (US);

Nazila Soleimani, San Jose, CA (US);

Jeroen Den Breejen, San Jose, CA (US);

Alan Andrew McReynolds, San Jose, CA (US);

Gregory Donald Guth, San Jose, CA (US);

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 27/15 (2006.01); H05K 1/11 (2006.01); F21K 9/65 (2016.01); F21K 9/61 (2016.01); H05B 45/10 (2020.01);
U.S. Cl.
CPC ...
H01L 27/153 (2013.01); F21K 9/61 (2016.08); F21K 9/65 (2016.08); H05B 45/10 (2020.01); H05K 1/118 (2013.01);
Abstract

A flexible printed circuit board and method of fabrication are disclosed. The flexible printed circuit board has a flexible body with multiple segments. Each segment has multiple body contacts that are electrically isolated from body contacts of each other segment. The flexible printed circuit further has multiple flexible legs in which each leg extends from a different segment and contains multiple leg contacts disposed proximate to a distal end of the leg from the body. Each leg contact is connected with a different body contact of the leg. The flexible printed circuit board is formed from a multilayer structure that includes: a dielectric layer, a metal layer adjacent to the dielectric layer, and a solder mask layer adjacent to the metal layer, the solder mask layer exposing portions of the metal layer to form the body contacts.


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