The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Sep. 16, 2019
Applicant:

Asahi Kasei Microdevices Corporation, Tokyo, JP;

Inventors:

Toshiaki Fukunaka, Tokyo, JP;

Koji Matsushita, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 27/146 (2006.01); H01L 31/0203 (2014.01); H01L 33/54 (2010.01); H01L 23/528 (2006.01); H01L 23/31 (2006.01); H01L 27/15 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 23/3128 (2013.01); H01L 23/528 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 27/156 (2013.01); H01L 31/0203 (2013.01); H01L 33/54 (2013.01); H01L 33/58 (2013.01);
Abstract

The optical device includes a photoelectric conversion block including a photoelectric conversion chip configured to include photoelectric conversion elements arranged in a matrix and a first sealing member configured to cover side faces of the photoelectric conversion chip to expose the photoelectric conversion chip and a lens block including a lens and a second sealing member configured to cover side faces of the lens to expose one surface and an other surface of the lens. In the lens block, the one surface of the lens and the second sealing member forms a recessed portion, at least a part of a bottom surface of the recessed portion being formed by the one surface of the lens, a sidewall of the recessed portion being formed by the second sealing member, and the recessed portion being arranged such that the photoelectric conversion chip exposed from the first sealing member is covered.


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