The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Jul. 29, 2019
Applicant:

Merry Electronics (Shenzhen) Co., Ltd., Guangdong, CN;

Inventor:

Chao-Sen Chang, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); G01L 5/00 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H04R 1/04 (2006.01); H04R 19/04 (2006.01); B81B 7/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); B81B 7/008 (2013.01); G01L 5/00 (2013.01); H01L 23/13 (2013.01); H01L 23/3121 (2013.01); H01L 23/5385 (2013.01); H01L 24/48 (2013.01); H04R 1/04 (2013.01); H04R 19/04 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/07 (2013.01); H01L 2224/48265 (2013.01); H04R 2201/003 (2013.01);
Abstract

A microphone package structure includes a substrate, a metal housing, a MEMS microphone component and at least one integrated circuit component. The substrate has a first surface and a second surface that are opposite to each other. The metal housing is located on the first surface such that the substrate and the metal housing collectively define a hollow chamber. The MEMS microphone component is located on the metal housing and within the hollow chamber. The at least one integrated circuit component is located within a region of the second surface on which the metal housing has a vertical projection.


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