The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Sep. 09, 2019
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventor:

Takamasa Ito, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 27/1157 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/5226 (2013.01); H01L 27/1157 (2013.01); H01L 27/11582 (2013.01);
Abstract

According to one embodiment, a device includes: a semiconductor in a first region of interconnects stacked in a first direction; a first conductor including a first body and a first protrusion, the first body provided in a first region, the first protrusion protruding from the first body in a second direction and overlapping with a second region adjacent to the first region in the second direction; a plug on the first protrusion; a insulator between the plug and the interconnects; a second conductor including a second body and a second protrusion, the second body on the first body and contacting the semiconductor, and the second protrusion on the first protrusion and protruding to the second body; and a first layer on the first protrusion, contacting the second protrusion and the insulator, and extending between the second protrusion and the insulator.


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