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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10943847 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Dec. 11, 2018

Semiconductor chip and semiconductor device

Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Kazuhiko Sugiura, Kariya, JP;

Tomohito Iwashige, Kariya, JP;

Jun Kawai, Kariya, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/62 (2006.01); H01L 29/739 (2006.01); H01L 23/40 (2006.01); H01L 29/78 (2006.01); H01L 23/58 (2006.01); H01L 23/36 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H01L 29/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 23/36 (2013.01); H01L 23/40 (2013.01); H01L 23/58 (2013.01); H01L 23/62 (2013.01); H01L 24/48 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 29/12 (2013.01); H01L 29/739 (2013.01); H01L 29/78 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor device includes a semiconductor chip having an electrode portion and a joining member electrically connected to the electrode portion to allow an electric current to flow in the semiconductor chip through the joining member. The joining member contains a protective material that has a positive temperature coefficient of resistivity, and the positive temperature coefficient of resistivity has a larger value in a temperature range higher than a threshold temperature than in a temperature range lower than the threshold temperature, the threshold temperature being a predetermined temperature lower than a breakdown temperature of the semiconductor chip. The electrode portion of the semiconductor chip may contain the protective material.

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