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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10943785 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Jul. 14, 2017

Laser irradiation apparatus and method for manufacturing semiconductor device

Applicant:

The Japan Steel Works, Ltd., Tokyo, JP;

Inventors:

Daisuke Ito, Yokohama, JP;

Tamotsu Odajima, Yokohama, JP;

Ryo Shimizu, Yokohama, JP;

Masashi Machida, Yokohama, JP;

Tatsuro Matsushima, Yokohama, JP;

Assignee:

THE JAPAN STEEL WORKS, LTD., Tokyo, JP;

Attorney:

SGPatents PLLC

Primary Examiner:

Richard A Booth

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/20 (2006.01); B23K 26/70 (2014.01); H01L 29/66 (2006.01); B23K 26/08 (2014.01); B23K 26/12 (2014.01); B23K 26/00 (2014.01); B23K 26/066 (2014.01); B23K 26/06 (2014.01); H01L 27/12 (2006.01); H01L 21/268 (2006.01); H01L 29/786 (2006.01); H01L 51/50 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2003 (2013.01); B23K 26/0006 (2013.01); B23K 26/066 (2015.10); B23K 26/0643 (2013.01); B23K 26/0861 (2013.01); B23K 26/125 (2013.01); B23K 26/127 (2013.01); B23K 26/703 (2015.10); B23K 26/705 (2015.10); H01L 21/268 (2013.01); H01L 27/1285 (2013.01); H01L 29/66765 (2013.01); H01L 29/78603 (2013.01); H01L 29/78663 (2013.01); H01L 51/5012 (2013.01); B23K 2101/40 (2018.08); B23K 2103/50 (2018.08);
Abstract

A laser irradiation apparatus () according to an embodiment includes an optical-system module () configured to apply laser light (L) to an object to be irradiated, a shield plate () in which a slit () is formed, through which the laser light (L) passes, and a reflected-light receiving component () disposed between the optical-system module () and the shield plate (), in which the reflected-light receiving component () is able to receive, out of the laser light (L), reflected light (R) reflected by the shield plate ().

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