The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Jun. 20, 2019
Applicant:
Epcos Ag, München, DE;
Inventors:
Markus Koini, Seiersberg, AT;
Christoph Auer, Graz, AT;
Jürgen Konrad, Graz, AT;
Franz Rinner, Deutschlandsberg, AT;
Markus Puff, Graz, AT;
Monika Stadlober, Graz, AT;
Thomas Wippel, Stainz, AT;
Assignee:
Epcos AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/38 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H01G 4/248 (2006.01); H01R 43/26 (2006.01);
U.S. Cl.
CPC ...
H01G 4/38 (2013.01); H01G 2/06 (2013.01); H01G 4/228 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H01R 43/26 (2013.01); H05K 1/181 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10757 (2013.01); H05K 2201/10818 (2013.01); H05K 2201/10909 (2013.01);
Abstract
An electrical connection contact () for a ceramic component () is specified. The connection contact () comprises a first material (M) and a second material (M) arranged thereon, wherein the first material (M) has a high electrical conductivity and the second material (M) has a low coefficient of thermal expansion.