The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Mar. 17, 2020
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Yoshinobu Ogawa, Numazu, JP;

Ryo Sugiyama, Mishima, JP;

Kazuaki Nagaoka, Susono, JP;

Kenta Matsunaga, Susono, JP;

Toru Ishii, Mishima, JP;

Hideya Arimura, Shizuoka, JP;

Fumihiko Utsuno, Suntou-gun, JP;

Tomoya Uesugi, Susono, JP;

Wataru Moriai, Suntou-gun, JP;

Masashi Uno, Mishima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/08 (2006.01); G03G 21/18 (2006.01);
U.S. Cl.
CPC ...
G03G 15/0818 (2013.01); G03G 21/1814 (2013.01);
Abstract

The electrophotographic member includes: an electroconductive substrate; and a surface layer having a mono-layer structure, wherein the surface layer has a matrix containing a cross-linked urethane resin as a binder, and when an elastic modulus of the matrix in a first region in a thickness direction from an outer surface of the surface layer to a depth of 0.1 μm from the outer surface of the surface layer is defined as E1, and an elastic modulus of the matrix in a second region in a thickness direction from a depth of 1.0 μm from the outer surface of the surface layer to 1.1 μm from the outer surface of the surface layer is defined as E2, E1 and E2 satisfy the following Expressions (1) and (2), respectively:1≥200 MPa  (1); and10 MPa≤2≤100 MPa  (2).


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