The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Jun. 12, 2015
Applicant:

Multidimension Technology Co., Ltd., Zhangjiagang, CN;

Inventors:

Songsheng Xue, Zhangjiagang, CN;

Weifeng Shen, Zhangjiagang, CN;

Lixian Feng, Zhangjiagang, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 21/02 (2006.01); G01N 27/22 (2006.01); G01K 7/22 (2006.01); G01L 9/04 (2006.01); G01N 27/12 (2006.01);
U.S. Cl.
CPC ...
G01D 21/02 (2013.01); G01K 7/22 (2013.01); G01L 9/045 (2013.01); G01N 27/121 (2013.01); G01N 27/128 (2013.01); G01N 27/225 (2013.01);
Abstract

A sensor chip is used for multi-physical quantity measurement. This sensor chip comprises a substrate and at least two of the following sensors: a temperature sensor, a humidity sensor, or a pressure sensor, which are integrated onto the same substrate, wherein the pressure sensor consists of electrically interconnected resistive elements. The humidity sensor is an interdigitated structure. Thermistor elements are placed around the pressure sensor and the humidity sensor to form a temperature sensor. The temperature sensor has a resistance adjusting circuit. A microcavity is etched on the back of the substrate in a place on the opposite side pressure sensor's location. Also disclosed is a preparation method for a sensor chip used for multi-physical quantity measurement. This multi-physical quantity measurement single chip sensor chip has the advantages of low cost, low power consumption, easy fabrication, and wide applicability.


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