The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Jul. 16, 2018
Applicant:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Inventors:
Sergey Mironets, Charlotte, NC (US);
Vijay Narayan Jagdale, South Windsor, CT (US);
Colette O. Fennessy, West Hartford, CT (US);
Assignee:
HAMILTON SUNSTRAND CORPORATION, Charlotte, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B22F 5/10 (2006.01); B23K 101/14 (2006.01); B23K 26/342 (2014.01); B23K 26/70 (2014.01); B28B 1/00 (2006.01); B28B 17/00 (2006.01); B29C 64/153 (2017.01); B29C 64/282 (2017.01); B29C 64/295 (2017.01); B29C 64/386 (2017.01); B29L 31/18 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); F28D 1/00 (2006.01); F28D 1/053 (2006.01); F28F 19/00 (2006.01);
U.S. Cl.
CPC ...
F28F 19/00 (2013.01); B22F 3/1055 (2013.01); B22F 5/10 (2013.01); B23K 26/342 (2015.10); B23K 26/702 (2015.10); B28B 1/001 (2013.01); B28B 17/0081 (2013.01); B29C 64/153 (2017.08); B29C 64/282 (2017.08); B29C 64/295 (2017.08); B29C 64/386 (2017.08); F28D 1/00 (2013.01); F28D 1/05316 (2013.01); B23K 2101/14 (2018.08); B29L 2031/18 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); F28F 2255/18 (2013.01); F28F 2260/00 (2013.01);
Abstract
A heat exchanger includes a core having a plurality of first layers for receiving a first fluid and at least one header arranged in fluid communication with the plurality of first layers. The at least one header is integrally formed ith the core via an additive manufacturing process. The header has a first microstructure and the core has a second, different microstructure.