The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Apr. 25, 2016
Applicant:
Seed Technologies Corp., Ltd., Hunan, CN;
Assignee:
SEED TECHNOLOGIES CORP., LTD., Hunan, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
E21B 10/46 (2006.01); C22C 32/00 (2006.01); F04D 29/22 (2006.01); B22F 3/105 (2006.01); C22C 29/00 (2006.01); B23K 15/00 (2006.01); B23K 15/06 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B28B 1/00 (2006.01); C22C 29/08 (2006.01); B22F 5/00 (2006.01); B33Y 80/00 (2015.01); E21B 10/54 (2006.01); B23K 15/02 (2006.01); F04D 29/02 (2006.01); F16L 9/14 (2006.01); B23K 101/20 (2006.01); B23K 101/00 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
E21B 10/46 (2013.01); B22F 3/1055 (2013.01); B23K 15/0006 (2013.01); B23K 15/0086 (2013.01); B23K 15/0093 (2013.01); B23K 15/02 (2013.01); B23K 15/06 (2013.01); B28B 1/001 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C22C 29/005 (2013.01); C22C 29/08 (2013.01); C22C 32/0047 (2013.01); F04D 29/2227 (2013.01); B22F 2005/001 (2013.01); B23K 2101/001 (2018.08); B23K 2101/20 (2018.08); B23K 2103/52 (2018.08); B33Y 80/00 (2014.12); E21B 10/54 (2013.01); F04D 29/026 (2013.01); F04D 29/22 (2013.01); F05D 2230/30 (2013.01); F05D 2300/177 (2013.01); F05D 2300/2263 (2013.01); F16L 9/14 (2013.01); Y02P 10/25 (2015.11);
Abstract
An additive manufacturing method for making a metal matrix composite component includes melting a powdered mixture with an electron beam. The powdered mixture comprises powdered tungsten carbide in an amount of 45 wt % to 72 wt % of the powdered mixture and a powdered binder in an amount of 28 wt % to 55 wt % of the powdered mixture. The powdered binder comprises boron, silicon, and nickel.