The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Jun. 20, 2019
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chien-Hsun Chu, Kaohsiung, TW;

Chien-Chou Tseng, Hsinchu, TW;

Ming-Huan Yang, Hsinchu, TW;

Tai-Jui Wang, Kaohsiung, TW;

Yu-Hua Chung, Zhutian Township, TW;

Chieh-Wei Feng, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); H01L 23/528 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
C25D 5/02 (2013.01); C25D 7/12 (2013.01); H01L 21/2885 (2013.01); H01L 23/528 (2013.01);
Abstract

A panel to be plated is provided. The panel includes a substrate and an electric field compensation structure. The substrate includes a plurality of units to be plated each including a first pattern to be plated. The electric field compensation structure is disposed on the substrate. The electric field compensation structure includes a second pattern to be plated surrounding at least one of the units to be plated. A ratio of an area of the first pattern to be plated of the units to be plated to an area of the second pattern to be plated of the electric field compensation structure is in a range from 1:0.07 to 1:0.3.


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