The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Jun. 13, 2017
Applicant:
General Electric Technology Gmbh, Baden, CH;
Inventors:
Assignee:
General Electric Technology GmbH, Baden, CH;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 19/05 (2006.01); C22C 19/03 (2006.01); B22F 3/105 (2006.01); C22C 1/04 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B23K 26/342 (2014.01); B23K 15/00 (2006.01); B23K 26/12 (2014.01); C22C 32/00 (2006.01); C22C 1/10 (2006.01); B22F 10/00 (2021.01);
U.S. Cl.
CPC ...
C22C 19/057 (2013.01); B22F 10/00 (2021.01); B23K 15/0086 (2013.01); B23K 26/123 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C22C 1/0433 (2013.01); C22C 1/0491 (2013.01); C22C 19/03 (2013.01); C22C 19/05 (2013.01); C22C 1/10 (2013.01); C22C 32/0052 (2013.01);
Abstract
A Ni-base superalloy composition to be used for powder-based additive manufacturing (AM) technology, such as selective laser melting (SLM) or electron beam melting (EBM). The cracking susceptibility during an AM process is considerably reduced by controlling the amount of elements, especially Hf, that form low-melting eutectics.