The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Feb. 21, 2017
Diamet Corporation, Niigata, JP;
Yoshinari Ishii, Niigata, JP;
Diamet Corporation, Niigata, JP;
Abstract
The Cu-based sintered sliding material has a composition including, by mass %, 7% to 35% of Ni, 1% to 10% of Sn, 0.9% to 3% of P, and 0.5% to 5% of C, with a remainder of Cu and inevitable impurities, wherein the Cu-based sintered sliding material includes a sintered body including: alloy grains that contain Sn and C and contain a Cu—Ni-based alloy as a main component; grain boundary phases that contain Ni and P as main components and are dispersedly distributed in grain boundaries of the alloy grains; and free graphite that intervenes at the grain boundaries of the alloy grains, the Cu-based sintered sliding material has a structure in which pores are dispersedly formed in the grain boundaries of the alloy grains, and an amount of C in a metal matrix including the alloy grains and the grain boundary phases is, by mass %, 0.02% to 0.20%.