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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10941320 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Nov. 12, 2018

Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Shinji Arimoto, Otsu, JP;

Takenori Fujiwara, Otsu, JP;

Masao Tomikawa, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

RatnerPrestia

Primary Examiner:

Kuo Liang Peng

Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 7/10 (2018.01); C08G 73/10 (2006.01); C09J 11/06 (2006.01); C08K 5/544 (2006.01); C09J 179/08 (2006.01); C09J 183/04 (2006.01); C11D 7/50 (2006.01); C08L 79/08 (2006.01); C08L 83/04 (2006.01); H01L 21/304 (2006.01); H01L 21/02 (2006.01); B32B 7/12 (2006.01); B32B 43/00 (2006.01); C09J 5/00 (2006.01); C09J 183/14 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C09J 7/10 (2018.01); B32B 7/12 (2013.01); B32B 43/006 (2013.01); C08G 73/10 (2013.01); C08K 5/544 (2013.01); C08L 79/08 (2013.01); C08L 83/04 (2013.01); C09J 5/00 (2013.01); C09J 11/06 (2013.01); C09J 179/08 (2013.01); C09J 183/04 (2013.01); C09J 183/14 (2013.01); C11D 7/50 (2013.01); C11D 7/5013 (2013.01); C11D 7/5022 (2013.01); H01L 21/02 (2013.01); H01L 21/0206 (2013.01); H01L 21/304 (2013.01); H01L 21/6835 (2013.01); B32B 2457/14 (2013.01); C09J 2203/00 (2013.01); C09J 2301/502 (2020.08); C09J 2400/10 (2013.01); C09J 2483/00 (2013.01); H01L 21/76898 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y02P 20/582 (2015.11);
Abstract

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

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