The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
May. 18, 2016
Matsumoto Yushi-seiyaku Co., Ltd., Yao, JP;
Sachiko Tokumura, Yao, JP;
Yu Kita, Yao, JP;
MATSUMOTO YUSHI-SEIYAKU CO., LTD., Osaka, JP;
Abstract
Heat-expandable microspheres and applications thereof, the heat-expandable microspheres including a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is produced by polymerizing a polymerizable component containing (A) a nitrile monomer including methacrylonitrile, (B) a carboxyl-group-containing monomer and (C) a monomer having a functional group reactive with the carboxyl group. The polymerizable component satisfies the following conditions 1 and 2: Condition 1: The weight fraction of the monomers (A), (B) and (C) in the polymerizable component satisfy the inequality shown below.Weight fraction of the monomer ()<Weight fraction of the monomer ()≤Weight fraction of the monomer ()  Inequality (I) Condition 2: The ratio by weight of the monomer (B) to the monomer (C) ranges from 600:1 to 3:1.