The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Feb. 11, 2019
Applicants:
University of South Carolina, Columbia, SC (US);
Clemson University, Clemson, SC (US);
Inventors:
Michael Van Tooren, Columbia, SC (US);
Igor Luzinov, Seneca, SC (US);
Assignees:
University of South Carolina, Columbia, SC (US);
Clemson University, Clemson, SC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/12 (2006.01); C08J 7/16 (2006.01); B29C 65/00 (2006.01); C08J 7/12 (2006.01); B29C 65/02 (2006.01); B29C 70/02 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01); B29C 37/00 (2006.01); B29C 65/48 (2006.01); B29C 71/02 (2006.01); B32B 38/00 (2006.01); B29K 63/00 (2006.01); B29K 701/10 (2006.01); B29K 701/12 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
C08J 5/128 (2013.01); B29C 37/0078 (2013.01); B29C 65/02 (2013.01); B29C 65/4835 (2013.01); B29C 66/026 (2013.01); B29C 66/112 (2013.01); B29C 66/114 (2013.01); B29C 66/1122 (2013.01); B29C 66/43441 (2013.01); B29C 66/45 (2013.01); B29C 66/712 (2013.01); B29C 66/721 (2013.01); B29C 66/7392 (2013.01); B29C 66/7394 (2013.01); B29C 66/73921 (2013.01); B29C 70/026 (2013.01); B32B 37/1207 (2013.01); B32B 37/144 (2013.01); C08J 7/08 (2013.01); C08J 7/12 (2013.01); C08J 7/16 (2013.01); B29C 66/71 (2013.01); B29C 66/7212 (2013.01); B29C 66/72141 (2013.01); B29C 66/72143 (2013.01); B29C 66/73751 (2013.01); B29C 66/73753 (2013.01); B29K 2063/00 (2013.01); B29K 2701/10 (2013.01); B29K 2701/12 (2013.01); B29L 2009/00 (2013.01); B32B 2037/1253 (2013.01); B32B 2038/0076 (2013.01); B32B 2398/10 (2013.01); B32B 2398/20 (2013.01); C08J 2300/22 (2013.01); C08J 2300/24 (2013.01); C08J 2309/00 (2013.01); C08J 2323/20 (2013.01); C08J 2333/04 (2013.01); C08J 2463/00 (2013.01);
Abstract
Disclosed are thermoset/thermoplastic composites that include a thermoset component directly or indirectly bonded to a thermoplastic component via a crosslinked binding layer between the two. The crosslinked binding layer is bonded to the thermoplastic component via epoxy linkages and is either directly or indirectly bonded to the thermoset component via epoxy linkages. The composite can be a laminate and can provide a route for addition of a thermoplastic implant to a thermoset structure.