The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Mar. 23, 2018
Applicants:

The Board of Trustees of the University of Alabama, Tuscaloosa, AL (US);

525 Solutions, Inc., Tuscaloosa, AL (US);

Inventors:

Robin D. Rogers, Tuscaloosa, AL (US);

Oleksandra Zavgorodnya, Tuscaloosa, AL (US);

Julia L. Shamshina, Tuscaloosa, AL (US);

Assignees:

THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA, Tuscaloosa, AL (US);

525 Solutions, Inc., Tuscaloosa, AL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/12 (2006.01); C08K 3/11 (2018.01); C08K 3/105 (2018.01); C07B 37/04 (2006.01); C08K 5/3445 (2006.01); C08K 5/47 (2006.01); C08K 5/3472 (2006.01); C08L 5/08 (2006.01); C08B 37/08 (2006.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
C08J 5/122 (2013.01); C07B 37/04 (2013.01); C08B 37/003 (2013.01); C08K 3/08 (2013.01); C08K 3/105 (2018.01); C08K 3/11 (2018.01); C08K 5/3445 (2013.01); C08K 5/3472 (2013.01); C08K 5/47 (2013.01); C08L 5/08 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0831 (2013.01); C08K 2003/0856 (2013.01); C08K 2003/0862 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01);
Abstract

Methods for making metal particle-chitin composite materials are described. The methods can comprise contacting an ionic liquid with chitin, thereby forming a mixture; contacting the mixture with a non-solvent, thereby forming a chitin substrate in the non-solvent; collecting the chitin substrate from the non-solvent; deacetylating the collected chitin substrate, thereby forming a deacetylated chitin substrate; contacting the deacetylated chitin substrate with a metal salt, thereby forming an impregnated precursor composite material; and contacting the impregnated precursor composite material with a reducing agent, thereby reducing the metal salt to form a plurality of metal particles dispersed on the chitin substrate and forming the metal particle-chitin composite material.


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