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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10941035 B1

PDFFull Text
Date of Patent:
Mar. 09, 2021

Filed:

Sep. 02, 2016

Method for producing structured surfaces

Applicant:

Leibniz-institut Für Neue Materialien Gemeinnützige Gmbh, Saarbrücken, DE;

Inventors:

Johannes H. M. Maurer, Homburg, DE;

Tobias Kraus, Saarbrücken, DE;

Lola González-García, Saarbrücken, DE;

Beate Reiser, Kaiserslautern, DE;

Ioannis Kanelidis, Saarbrücken, DE;

Peter William de Oliveira, Saarbrücken, DE;

Jenny Kampka, Ensdorf, DE;

Karsten Moh, Blieskastel-Brenschelbach, DE;

Assignee:

Leibniz-Institut für Neue Materialien gemeinnützige GmbH, Saarbrücken, DE;

Attorney:

Cahn & Samuels, LLP

Primary Examiner:

Brian K Talbot

Int. Cl.
CPC ...
B05D 5/12 (2006.01); B81C 1/00 (2006.01); G02F 1/1343 (2006.01); G03F 7/00 (2006.01); H01L 51/00 (2006.01); H01L 51/44 (2006.01); H01L 31/0224 (2006.01); G06F 3/041 (2006.01); H01L 31/0216 (2014.01); H01Q 1/22 (2006.01); G02F 1/1333 (2006.01); C23C 18/12 (2006.01); B05D 3/12 (2006.01); B05D 1/32 (2006.01); H05K 3/04 (2006.01); H05K 3/14 (2006.01); H05K 3/12 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
B81C 1/0046 (2013.01); G02F 1/13439 (2013.01); G03F 7/0002 (2013.01); G06F 3/041 (2013.01); H01L 31/02167 (2013.01); H01L 31/022466 (2013.01); H01L 51/0022 (2013.01); H01L 51/442 (2013.01); H01Q 1/2208 (2013.01); B05D 1/32 (2013.01); B05D 3/12 (2013.01); B05D 5/12 (2013.01); B81B 2203/04 (2013.01); C23C 18/1262 (2013.01); G02F 1/13338 (2013.01); G02F 2202/36 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 1/09 (2013.01); H05K 3/048 (2013.01); H05K 3/1208 (2013.01); H05K 3/1225 (2013.01); H05K 3/143 (2013.01); Y02E 10/549 (2013.01); Y02P 70/50 (2015.11);
Abstract

A process for producing a structured surface, in which a composition comprising nanowires is applied to a surface and structured, especially by partial displacement of the composition. When the solvent is removed, the nanowires aggregate to form structures. These may be transparent and also conductive.

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