The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Sep. 27, 2017
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Daniel J Kovach, Renton, WA (US);

Gary E Georgeson, Tacoma, WA (US);

Robert J Miller, Fall City, WA (US);

Jeffrey D Morgan, Auburn, WA (US);

Diane Rawlings, Bellevue, WA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); B64D 45/02 (2006.01); H01B 5/00 (2006.01); B29C 63/00 (2006.01); C08K 3/08 (2006.01); B32B 37/12 (2006.01); B32B 38/10 (2006.01); H05B 6/10 (2006.01); H05B 6/02 (2006.01); C08L 11/00 (2006.01);
U.S. Cl.
CPC ...
B64D 45/02 (2013.01); B29C 63/0013 (2013.01); B32B 43/006 (2013.01); C08K 3/08 (2013.01); H01B 5/00 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); B32B 2307/208 (2013.01); B32B 2405/00 (2013.01); C08K 2201/01 (2013.01); C08L 11/00 (2013.01); H05B 6/02 (2013.01); H05B 6/10 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1917 (2015.01); Y10T 428/24843 (2015.01);
Abstract

Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an 'on-demand' de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.


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