The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Sep. 25, 2020
Applicant:

Coretech System Co., Ltd., Chupei, TW;

Inventors:

Yuan-Jung Chang, Chupei, TW;

Rong-Yeu Chang, Chupei, TW;

Chen-Chieh Wang, Chupei, TW;

Chia-Hsiang Hsu, Chupei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/77 (2006.01); G06F 30/28 (2020.01); B29C 45/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/77 (2013.01); B29C 45/0046 (2013.01); G06F 30/28 (2020.01); B29C 2945/76859 (2013.01);
Abstract

The present disclosure provides a molding system for preparing molding articles. The molding system includes a molding machine; a mold disposed on the molding machine and having a mold cavity for being filled with a molding resin; a processing module configured to generate a mechanical pressure distribution of the molding resin in the mold cavity based on a molding condition for the molding machine, wherein the mechanical pressure distribution of the molding resin is generated based in part on a bulk viscosity effect of the molding resin; and a controller operably communicating with the processing module and configured to operate the molding machine for transferring the fluid molding material into the mold cavity with the molding condition using the generated pressure distribution of the molding resin to perform an actual molding process for preparing the molding article.


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