The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2021
Filed:
Sep. 22, 2017
Applicant:
Kyoraku Co., Ltd., Kyoto, JP;
Inventors:
Yoshihiro Yamasaki, Kanagawa, JP;
Teruo Tamada, Tokyo, JP;
Yu Igarashi, Kanagawa, JP;
Yuta Minamigawa, Kanagawa, JP;
Assignee:
KYORAKU CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 44/12 (2006.01); B29C 44/42 (2006.01); B29C 44/58 (2006.01); B29C 44/00 (2006.01); B29C 48/00 (2019.01); B29C 44/08 (2006.01); B29C 51/30 (2006.01); B29C 44/48 (2006.01); B29C 44/50 (2006.01); B29C 51/36 (2006.01); B29C 51/10 (2006.01); B29C 51/32 (2006.01);
U.S. Cl.
CPC ...
B29C 44/1285 (2013.01); B29C 44/00 (2013.01); B29C 44/08 (2013.01); B29C 44/42 (2013.01); B29C 44/48 (2013.01); B29C 44/505 (2016.11); B29C 44/58 (2013.01); B29C 48/0017 (2019.02); B29C 51/10 (2013.01); B29C 51/30 (2013.01); B29C 51/32 (2013.01); B29C 51/36 (2013.01);
Abstract
A method for manufacturing a foam molded body which can allow the foam resin sheet to follow the shape of the cavity of the mold with high accuracy even when the thickness of the foam resin sheet is thick. The method includes an arranging step to arrange one sheet of a foam resin sheet between first and second molds, the foam resin sheet being formed by extruding and dangling a molten foam resin from a slit; and an expanding step to expand the foam resin sheet by subjecting the foam resin sheet to a reduced pressure suction.