The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 2021

Filed:

Aug. 23, 2016
Applicant:

Tanaka Kikinzoku Kogyo K.k., Tokyo, JP;

Inventors:

Teruhisa Iwai, Tsukuba, JP;

Yuichi Makita, Tsukuba, JP;

Hidekazu Matsuda, Tsukuba, JP;

Hitoshi Kubo, Tsukuba, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); B22F 9/30 (2006.01); H01B 1/22 (2006.01); C08J 7/06 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); C08J 3/20 (2006.01); C08K 3/08 (2006.01); C08K 5/17 (2006.01); H01C 17/065 (2006.01); C08K 9/04 (2006.01); B22F 5/00 (2006.01); H01C 7/00 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0062 (2013.01); B22F 1/0018 (2013.01); B22F 1/0022 (2013.01); B22F 9/30 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); C08J 3/20 (2013.01); C08J 7/06 (2013.01); C08K 3/08 (2013.01); C08K 5/17 (2013.01); H01B 1/22 (2013.01); H01C 17/06526 (2013.01); H01C 17/06586 (2013.01); H05K 1/092 (2013.01); H05K 3/1283 (2013.01); B22F 5/00 (2013.01); B22F 2301/255 (2013.01); C08J 2301/28 (2013.01); C08J 2367/02 (2013.01); C08K 9/04 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/005 (2013.01); H01C 7/003 (2013.01);
Abstract

A metal paste formed by kneading a solid content including silver particles and a solvent, in which the solid content includes silver particles containing silver particles having a particle size of 100 to 200 nm by 30% or more based on the number of particles, the silver particles have an average particle size of 60 to 800 nm as a whole, the silver particles constituting the solid content are bound with an amine compound having 4 to 8 carbon atoms in total as a protective agent, and the metal paste contains as an additive a high-molecular-weight ethyl cellulose having a number average molecular weight of 40000 to 90000. Since the metal paste contains a high-molecular-weight ethyl cellulose, a sintered body having a low resistance can be maintained while printability is improved. The metal paste has favorable printability, and can form a sintered body having a low resistance even in a low temperature region of 150° C. or lower.


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