The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Aug. 22, 2019
Getac Technology Corporation, Hsinchu County, TW;
Hung-Chan Cheng, Taipei, TW;
Wei-Chung Hsiao, Taipei, TW;
GETAC TECHNOLOGY CORPORATION, Hsinchu County, TW;
Abstract
The present invention relates to a heat dissipation module and an assembly method thereof. The heat dissipation module includes a heat conductive plate and a buffer member. The heat conductive plate includes a cover section and a first extension section. The cover section covers a heat zone. The buffer member is provided at the heat conductive plate to interferingly match with a housing, so as to conduct heat energy produced by the heat zone to the housing. Accordingly, by configuring the buffer member between the heat conductive plate and the housing, the heat conductive plate is allowed to be reliably thermally adhered to the housing, thereby achieving enhanced heat dissipation efficiency for the heat dissipation module.