The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Mar. 04, 2020
Taiyo Yuden Co., Ltd., Tokyo, JP;
Yuichi Sugiyama, Tokyo, JP;
Masashi Miyazaki, Tokyo, JP;
Yutaka Hata, Tokyo, JP;
Hiroyuki Kobayashi, Tokyo, JP;
TAIYO YUDEN CO., LTD., Tokyo, JP;
Abstract
A manufacturing method of a multilayer board includes: forming a metal core layer including a main body, an island portion, and four connection portions, the island portion having a substantially rectangle shape and being located in an opening formed in the main body, the opening having a substantially rectangle shape, the four connection portions connecting side surfaces of four corners of the island portion or side surfaces of vicinities of the four corners of the island portion to a side surface of the main body; forming a first insulating layer on the metal core layer and in the opening; and forming, in the first insulating layer, a hole reaching each of the four connection portions and removing at least a part of each of the four connection portions through the hole to electrically separate the main body and the island portion from each other