The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Feb. 03, 2016
Applicant:
The Boeing Company, Chicago, IL (US);
Inventor:
Minas H. Tanielian, Bellevue, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C25D 5/54 (2006.01); H01B 1/04 (2006.01); C23C 14/18 (2006.01); C23C 28/00 (2006.01); H01B 1/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C23C 14/18 (2013.01); C23C 28/322 (2013.01); C23C 28/34 (2013.01); C23C 28/42 (2013.01); C25D 5/54 (2013.01); H01B 1/04 (2013.01); H01B 1/24 (2013.01); H05K 1/097 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0379 (2013.01);
Abstract
A method of forming a high-conductivity electrical interconnect on a substrate may include forming a graphene film with a plurality of graphene members, depositing a metal over the graphene film, and providing a metallic overlay that connects the plurality of graphene members together through the depositing operation to form a covered graphene film.