The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Jan. 28, 2019
Applicant:
Eagle Technology, Llc, Melbourne, FL (US);
Inventors:
Clarke O. Fowler, Merritt Island, FL (US);
Voi Nguyen, Oviedo, FL (US);
Assignee:
EAGLE TECHNOLOGY, LLC, Melbourne, FL (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 1/24 (2006.01); H05K 1/14 (2006.01); H05K 3/32 (2006.01); H05K 1/11 (2006.01); H01R 13/6474 (2011.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); H01Q 1/243 (2013.01); H05K 1/144 (2013.01); H05K 3/32 (2013.01); H01R 13/6474 (2013.01); H05K 1/11 (2013.01); H05K 1/117 (2013.01); H05K 1/119 (2013.01);
Abstract
Systems and methods for making an interconnect device for electronic circuits. The methods comprise: fabricating a housing as a single 3D printed part having a plurality of apertures with bend angles less than ninety degrees; inserting wires into the plurality of apertures of the housing; and establishing electrical connections respectively between (A) the wires and a plurality of first socket adaptors and (B) the wires and a plurality of second socket adaptors.