The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Sep. 25, 2019
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Jeong Wan Kim, Daejeon, KR;
Hyunki Cho, Daejeon, KR;
Assignee:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 37/00 (2006.01); B29C 70/68 (2006.01); B29C 70/74 (2006.01); B29C 70/88 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0256 (2013.01); B29C 37/00 (2013.01); B29C 70/681 (2013.01); B29C 70/74 (2013.01); B29C 70/882 (2013.01); H05K 1/0216 (2013.01); H05K 3/0091 (2013.01); H05K 3/28 (2013.01); B29C 2037/90 (2013.01); B29L 2031/3425 (2013.01); H05K 2203/1327 (2013.01); H05K 2203/163 (2013.01);
Abstract
A partially molded substrate and a partial molding apparatus and a method thereof, which cover and mold each of one or more conductors formed on the substrate with the insulator to prevent the sizes of the substrate from being increased due to molding, thereby efficiently preventing high voltage between the conductors on the substrate from being applied, and thereby preventing interference around the conductor.