The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Dec. 19, 2019
Applicant:

Honeywell International Inc., Morris Plains, NJ (US);

Inventors:

Pedro Luis Lebron, San Antonio, PR (US);

Alejandro José Fernández, Isabela, PR (US);

Assignee:

Honeywell International Inc., Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05B 1/00 (2006.01); H05B 3/02 (2006.01); H05B 3/28 (2006.01); H01L 23/34 (2006.01); H01L 23/38 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 1/0212 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10219 (2013.01);
Abstract

Systems and methods for a printed circuit board assembly comprising a thermoelectric device at least partially embedded within the printed circuit board assembly are provided. The thermoelectric device is configured to adjust a temperature of the printed circuit board assembly based on the measurements of one or more sensors coupled to the printed circuit board assembly. Additionally, a control circuit is coupled to the at least one thermoelectric device and the one or more sensors, wherein the control circuit is configured to control the at least one thermoelectric device, and wherein the control circuit is configured to monitor a temperature set point at one or more target locations in the printed circuit board assembly.


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