The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Jul. 07, 2019
Applicant:

J.s.t. Corporation, Farmington Hills, MI (US);

Inventor:

Vikas Azad, Novi, MI (US);

Assignee:

J.S.T. CORPORATION, Farmington Hills, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/6599 (2011.01); B60R 16/03 (2006.01); H01R 13/502 (2006.01); H01R 13/6581 (2011.01); H01R 13/6596 (2011.01); H01R 13/74 (2006.01); H01R 13/426 (2006.01); H01R 13/436 (2006.01); H01R 13/52 (2006.01); H01R 13/53 (2006.01); H01R 13/73 (2006.01); H01R 43/20 (2006.01); H01R 13/533 (2006.01); H01R 13/6598 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6599 (2013.01); B60R 16/03 (2013.01); H01R 13/426 (2013.01); H01R 13/4367 (2013.01); H01R 13/502 (2013.01); H01R 13/5202 (2013.01); H01R 13/53 (2013.01); H01R 13/533 (2013.01); H01R 13/6581 (2013.01); H01R 13/6596 (2013.01); H01R 13/73 (2013.01); H01R 13/748 (2013.01); H01R 43/20 (2013.01); H01R 13/6598 (2013.01); H01R 2201/26 (2013.01);
Abstract

An electromagnetic interference (EMI) grounding protection method for a connector assembly using a multi-directional conductive housing. The method includes the steps of: conducting the EMI generated by a source towards a metallic braided shield, the metallic braided shield being secured and mounted onto the multi-directional conductive housing by a metallic clamp; conducting the EMI from the metallic braided shield to the metallic clamp and to the multi-directional conductive housing, the multi-directional conductive housing being mounted onto a metallic device by at least a metallic bolt and the bolt being accommodated within a corresponding metallic compression limiter; and thereafter, conducting the EMI: (1) from the metallic braided shield to the multi-directional conductive housing through the metallic compression limiters and through their respective bolts, and ultimately to the metallic device, and (2) from the metallic braided shield to the multi-directional conductive housing directly through conductive pads thereof, and ultimately to the metallic device.


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