The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Mar. 02, 2015
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Akira Ohmae, Kanagawa, JP;
Yusuke Kataoka, Kanagawa, JP;
Tatsuo Ohashi, Kanagawa, JP;
Ippei Nishinaka, Kanagawa, JP;
Goshi Biwa, Kanagawa, JP;
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/40 (2010.01); H01L 33/62 (2010.01); F21V 23/00 (2015.01); G06F 3/147 (2006.01); H01L 25/075 (2006.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 33/40 (2013.01); F21V 23/003 (2013.01); G06F 3/147 (2013.01); H01L 25/0753 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01L 33/62 (2013.01); H01L 2224/14 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01);
Abstract
[Solving Means] A semiconductor unit includes a substrate, a semiconductor device, and a plating layer. The semiconductor device includes a semiconductor layer and one or more electrodes, the one or more electrodes being connected to the semiconductor layer and including a platinum-group element as a main material. The plating layer bonds the substrate and the electrode.