The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Feb. 24, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ralf Siemieniec, Villach, AT;

Mihai Draghici, Villach, AT;

Jens Peter Konrath, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/07 (2006.01); H01L 29/80 (2006.01); H01L 29/868 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/808 (2006.01); H01L 29/45 (2006.01); H01L 29/16 (2006.01); H01L 29/872 (2006.01); H01L 29/36 (2006.01); H01L 29/06 (2006.01); H01L 29/47 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0727 (2013.01); H01L 29/0619 (2013.01); H01L 29/1608 (2013.01); H01L 29/36 (2013.01); H01L 29/401 (2013.01); H01L 29/45 (2013.01); H01L 29/6606 (2013.01); H01L 29/66068 (2013.01); H01L 29/806 (2013.01); H01L 29/8083 (2013.01); H01L 29/868 (2013.01); H01L 29/872 (2013.01); H01L 29/47 (2013.01);
Abstract

A method for forming a semiconductor device includes: forming, in a silicon carbide layer of a first conductivity type having a first side, a first silicon carbide region and a second silicon carbide region that forms a pn-junction with the first silicon carbide region; forming a contact region that forms an Ohmic contact with the second silicon carbide region; forming a barrier-layer on the contact region and the first silicon carbide region so that a Schottky-junction is formed between the barrier-layer and the first silicon carbide region and so that an Ohmic connection is formed between the barrier-layer and the contact region, the barrier-layer comprising molybdenum nitride; and forming a first metallization on the barrier-layer, and in Ohmic connection with the barrier-layer.


Find Patent Forward Citations

Siemieniec, Ralf. (2021). Method of manufacturing a semiconductor device (U.S. Patent No. 10937784). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10937784

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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