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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10937774 B1

PDFFull Text
Date of Patent:
Mar. 02, 2021

Filed:

Jan. 31, 2019

Micro led display panel, method for fabricating the same and display device

Applicant:

Shanghai Tianma Micro-electronics Co., Ltd., Shanghai, CN;

Inventors:

Jujian Fu, Shanghai, CN;

Gang Liu, Shanghai, CN;

Assignee:

SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD., Shanghai, CN;

Attorney:

Kilpatrick Townsend & Stockton, LLP

Primary Examiner:

Sue A Purvis

Assistant Examiner:

Scott Stowe

Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 33/52 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/42 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 21/6835 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 33/52 (2013.01); H01L 33/42 (2013.01); H01L 33/504 (2013.01); H01L 33/505 (2013.01); H01L 33/508 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/83855 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A Micro LED display panel, a method for fabricating the Micro LED display panel and a display device are provided. When the LED chip array is transferred, it may only be required to embed the LED chip array into the adhesive film layer. The LED chip array is bonded to the array substrate through the adhesive film layer. Then, unnecessary portions of the adhesive film layer and unnecessary LED chips are removed. It is not necessary to attach LED chips in the LED chip array one by one to the substrate by soldering, in which case the process of fabricating the Micro LED display panel is simplified, the difficulty in fabricating the Micro LED display panel is reduced, the influence of the high temperature generated by the soldering process on the LED chips is avoided, and damage to the LED chips during the transfer process is avoided.

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