The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

May. 11, 2017
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Sandra Louise Petty-Weeks, Newport Beach, CA (US);

Guohao Zhang, Nanjing, CN;

Hardik Bhupendra Modi, Irvine, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/00 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 23/66 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48159 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48644 (2013.01); H01L 2224/48844 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01); H05K 1/0243 (2013.01); H05K 3/244 (2013.01); H05K 2201/0341 (2013.01);
Abstract

This disclosure relates to a radio frequency (RF) transmission line for high performance RF applications. The RF transmission line includes a bonding layer having a bonding surface and configured to receive an RF signal, a barrier layer proximate the bonding layer, a diffusion barrier layer proximate the bonding layer and configured to prevent contaminant from entering the bonding layer, and a conductive layer proximate the diffusion barrier layer. The diffusion barrier layer has a thickness that allows the received RF signal to penetrate the diffusion barrier layer to the conductive layer. The diffusion barrier layer can be a nickel layer.


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