The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Sep. 12, 2019
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Houssam Kanj, Waterloo, CA;

Wenyao Zhai, Kanata, CA;

Hari Krishna Pothula, Kanata, CN;

Morris Repeta, Ottawa, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/38 (2006.01); H01L 23/66 (2006.01); H05K 1/02 (2006.01); H01P 5/22 (2006.01); H01P 3/20 (2006.01); H01P 3/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/09 (2013.01); H01P 3/081 (2013.01); H01P 3/20 (2013.01); H01P 5/22 (2013.01); H03H 7/38 (2013.01); H05K 1/0246 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6633 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02379 (2013.01); H01L 2924/15311 (2013.01);
Abstract

The disclosed systems, structures, and methods are directed to a mm-Wave communication structure employing a first transmission structure employing a first ring transition structure followed by a first ground structure and a second ground structure configured to carry a ground signal, a second transmission structure employing a second ring transition structure followed by a third ground structure and a fourth ground structure configured to carry the ground signal, a third transmission structure configured to carry a mm-Wave signal, wherein the third transmission structure begins at the center of the first ring transition structure and the second ring transition structure and the third transmission structure is coplanar with the second transmission structure, and a fourth transmission structure configured to operatively couple an IC and the first transmission layer, the second transmission layer, and the third transmission structure.


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