The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Jan. 08, 2016
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
O-hyun Beak, Seoul, KR;
Keon Kuk, Yongin-si, KR;
Young-chul Ko, Suwon-si, KR;
Woon-bae Kim, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H04W 4/50 (2018.01); H01L 23/29 (2006.01); B05C 5/00 (2006.01); B05C 5/02 (2006.01); H01L 21/02 (2006.01); H01L 21/3205 (2006.01); H01L 21/67 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); B05C 5/001 (2013.01); B05C 5/027 (2013.01); H01L 21/02255 (2013.01); H01L 21/32051 (2013.01); H01L 21/67115 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 23/481 (2013.01); H01L 24/49 (2013.01); H04W 4/50 (2018.02); H05K 1/181 (2013.01); H01L 21/56 (2013.01); H01L 23/3135 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/92 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/14511 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01);
Abstract
A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.