The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2021
Filed:
Oct. 17, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/552 (2013.01); H01L 2924/3025 (2013.01);
Abstract
An electronic component module includes a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant encapsulating the electronic element; a first shielding member disposed on a first surface of the encapsulant to surround the electronic element; a second shielding member disposed on a second surface of the encapsulant and spaced apart from the first shielding member; a shielding layer covering the first shielding member and the second shielding member; and a connection member connecting the electronic element to the second shielding member.