The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

Jul. 28, 2017
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventor:

Masaki Taya, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/24 (2006.01); H01L 25/18 (2006.01); H02M 1/00 (2006.01); H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/28 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 23/28 (2013.01); H01L 23/29 (2013.01); H01L 23/291 (2013.01); H01L 23/31 (2013.01); H01L 23/3142 (2013.01); H01L 24/73 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H02M 1/00 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A power module that can realize insulation performance by suppressing the occurrence of bubbles in silicone gel and the detachment between the silicone gel and an insulating substrate during high temperature, during low temperature and during low atmospheric pressure, to thereby suppress degradation of insulation performance. The power module includes: an insulating substrate having a front surface on which a power semiconductor element is mounted; a base plate joined to a back surface of the insulating substrate; a case fixed to the base plate and surrounding the insulating substrate; a cover fixed to the case and forming a sealed region; and a silicone gel serving as a filling member filling the entire sealed region and having internal stress maintained at compressive stress.


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