The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2021

Filed:

May. 12, 2020
Applicant:

X Display Company Technology Limited, Dublin, IE;

Inventors:

Ronald S. Cok, Rochester, NY (US);

David Gomez, Holly Springs, NC (US);

Tanya Yvette Moore, Hurdle Mills, NC (US);

Matthew Alexander Meitl, Durham, NC (US);

Christopher Andrew Bower, Raleigh, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 33/00 (2010.01); H01L 31/18 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/52 (2013.01); H01L 31/1892 (2013.01); H01L 33/0095 (2013.01);
Abstract

An example of a printed structure comprises a target substrate and a structure protruding from a surface of the target substrate. A component comprising a component substrate separate and independent from the target substrate is disposed in alignment with the structure on the surface of the target substrate within 1 micron of the structure. An example method of making a printed structure comprises providing the target substrate with the structure protruding from the target substrate, a transfer element, and a component adhered to the transfer element. The component comprises a component substrate separate and independent from the target substrate. The transfer element and adhered component move vertically toward the surface of the target substrate and horizontally towards the structure until the component physically contacts the structure or is adhered to the surface of the target substrate. The transfer element is separated from the component.


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