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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10937671 B1

PDFFull Text
Date of Patent:
Mar. 02, 2021

Filed:

Mar. 19, 2019

Conductive heat spreader and heat sink assembly for optical devices

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Fuad Elias Doany, Katonah, NY (US);

Mark Schultz, Ossining, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorney:

Amin, Turocy & Watson, LLP

Primary Examiner:

Tu-Tu V Ho

Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/31 (2006.01); H01R 12/72 (2011.01); G02B 6/42 (2006.01); H01S 5/024 (2006.01); H01L 25/065 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); G02B 6/4268 (2013.01); H01L 21/486 (2013.01); H01L 21/4882 (2013.01); H01L 23/3107 (2013.01); H01L 23/36 (2013.01); H01L 24/49 (2013.01); H01L 25/0655 (2013.01); H01R 12/722 (2013.01); H01S 5/02476 (2013.01); H05K 7/20509 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29007 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/834 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15159 (2013.01); H01S 5/02469 (2013.01); H01S 5/4025 (2013.01);
Abstract

Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.

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